说明
技术参数
外观:
无色透明液体
纯度(GC):≥97.00
含水量:≤0.30%
益处
高活性
粘度极低
应用
207 主要用作喷墨单体,也可用于稀释其他氧杂环丁烷、树脂和单体。
储存和包装
保存在密闭容器中,并存放在阴凉、干燥、避光、通风的地方。自生产日期起 1 年内有效。包装:200 千克/桶。
207 是一种双官能氧杂环丁烷,适用于阳离子固化。它可以提高固化速度,降低收缩率。由于 207 具有三元和四元环氧的独特结构,因此它的粘度很低,稀释性很好。
产品信息
化学名称:(3-乙基-3-((环氧乙烷-2-基甲氧基)甲基)氧杂环丁烷
分子量:172.22
化学文摘社编号:15957-34-3
技术参数
外观:
无色透明液体
纯度(GC):≥97.00
含水量:≤0.30%
益处
高活性
粘度极低
应用
207 主要用作喷墨单体,也可用于稀释其他氧杂环丁烷、树脂和单体。
储存和包装
保存在密闭容器中,并存放在阴凉、干燥、避光、通风的地方。自生产日期起 1 年内有效。包装:200 千克/桶。
1.阳离子紫外线/热固化涂料:
Used as a reactive diluent or crosslinking monomer in cationic UV/thermal curing coating systems, reducing viscosity and increasing crosslinking density. The cured coating exhibits excellent chemical resistance, adhesion, and weatherability, suitable for industrial protection and decoration of substrates such as metals, plastics, and wood, especially for coatings requiring high weather resistance and low yellowing.
2.电子材料和包装:
Used in PCB solder mask inks, electronic component encapsulation materials, and insulating coatings. The cured material exhibits stable dielectric properties, excellent insulation, and resistance to humidity and heat, ensuring the stable operation of electronic devices under complex working conditions. Suitable for microelectronic packaging and precision processing of circuit boards.
3.光学材料制备:
Applied in optical films, optical adhesives, and other fields, it reduces curing volume shrinkage, improves the dimensional stability and light transmittance of optical components, meeting the high precision and high transparency requirements of optical lenses and display devices.
4.光刻胶和微电子加工:
Used as a crosslinking component or resin matrix in photoresists, compatible with i-line, KrF, and other photolithography processes, facilitating the preparation of high-resolution patterns. Suitable for the precision processing of semiconductor chips and microelectronic devices, improving device integration and reliability.
5.特种粘合剂和密封剂:
Used in the preparation of cationic curing adhesives and sealants, improving product fluidity and wettability, and enhancing the bonding strength and sealing effect on substrates such as metals, ceramics, and engineering plastics. Suitable for structural bonding and sealing in high-end industrial fields such as aerospace and automotive manufacturing.
6.复合材料基质树脂:
Combined with glass fibers, carbon fibers, and other materials to prepare high-performance composite materials, improving the mechanical strength, aging resistance, and processing fluidity of the materials. Suitable for the preparation of structural components with stringent requirements for overall material performance in aerospace and rail transit.
7. Resin Modification and Synthesis:
Used as a modifying monomer in the synthesis and modification of epoxy resins, polyester resins, etc., reducing system viscosity and improving the flexibility, weather resistance, and chemical resistance of the cured product. Suitable for the development of resin systems with high performance requirements.