1. UV-Curing Coatings:

Used as a reactive diluent and functional monomer in UV-curing coatings, suitable for substrates such as wood, plastics, and metals, providing high hardness, excellent adhesion, low shrinkage, and chemical resistance. It can be used in anticorrosive coatings, plastic surface treatment coatings, and conformal coatings for electronic circuit boards (moisture-proof, salt spray-proof, and mildew-proof).

2. UV-Curing Inks:

Used in printing inks (such as packaging, labels, and PCB circuit board inks), improving curing speed, abrasion resistance, and solvent resistance, suitable for flexographic and screen printing processes.

3. UV-Curing Adhesives:

Used in structural and encapsulating adhesives for optical components, electronic devices, automotive, and aerospace applications, offering high transparency, low shrinkage, good bonding strength, and high-temperature resistance.

4. 3D Printing Materials:

As a key monomer in photocurable 3D printing resins, it provides printed parts with high Tg (approximately 120℃), low shrinkage, and good mechanical properties, suitable for high-precision industrial and dental models.

5. Resin Modification and Synthesis:

Used for the modification of acrylic resins, improving the crosslinking density, water resistance, and chemical resistance of the resin, expanding its applications in coatings, adhesives, and other fields.

6. Composite Materials:

Used in fiberglass modification to improve the interfacial bonding strength of the resin matrix, and also used in carbon fiber prepregs to improve fiber wettability.

7. Electronic Packaging Materials:

Participates in the preparation of electronic component packaging materials, enhancing the material’s moisture and heat resistance and insulation performance, ensuring the stability of electronic devices in complex environments.

8. Fine Chemical Intermediates:

Used in the synthesis of other fine chemicals, such as insecticides and fungicides in the pesticide field.