说明
技术参数
外观:
非常粘稠的黄色液体至固体
含水量:≤0.15%
益处
高活性
良好的耐化学性和出色的物理强度
应用
203 通常用作电子材料包装和特殊粘合剂的单体。使用前请预热至 50~60 ºC 以降低粘度。
储存和包装
请密封保存,并存放在阴凉、干燥、避光、通风的地方。开封后会逐渐吸潮失效。自生产日期起 6 个月内有效。包装:20 千克/包。
203 是一种双官能氧杂环丁烷,适用于阳离子固化。它可以提高固化速度,降低收缩率,提供良好的耐化学性和优异的物理强度。
产品信息
化学名称:1,4-双[(3-乙基-3-氧杂环丁酰甲氧基)甲基]苯
分子量:334.45
化学文摘社编号:142627-97-2
技术参数
外观:
非常粘稠的黄色液体至固体
含水量:≤0.15%
益处
高活性
良好的耐化学性和出色的物理强度
应用
203 通常用作电子材料包装和特殊粘合剂的单体。使用前请预热至 50~60 ºC 以降低粘度。
储存和包装
请密封保存,并存放在阴凉、干燥、避光、通风的地方。开封后会逐渐吸潮失效。自生产日期起 6 个月内有效。包装:20 千克/包。
1.阳离子紫外线/热固化涂料:
Used as a crosslinking monomer or reactive diluent in cationic UV/thermal curing coating systems, it reduces viscosity and increases the crosslinking density of the cured product. The cured coating exhibits excellent chemical resistance, weather resistance, and adhesion, making it suitable for industrial protection and decoration of substrates such as metals, plastics, and wood, especially for coatings requiring high weather resistance and low yellowing.
2.电子材料和印刷电路板制造:
Used in PCB solder mask inks, electronic component encapsulation materials, and insulating coatings, the cured material exhibits stable dielectric properties, excellent insulation, and resistance to humidity and heat, ensuring the stable operation of electronic devices under complex working conditions. It is suitable for microelectronic packaging and precision processing of circuit boards.
3.光学材料制备:
Applied in fields such as optical films and optical adhesives, it reduces curing volume shrinkage, improves the dimensional stability and light transmittance of optical components, meeting the high precision and high transparency requirements of optical lenses and display devices.
4.光刻胶和微电子加工:
As a crosslinking component or resin matrix for photoresists, it is compatible with i-line, KrF, and other photolithography processes, facilitating the preparation of high-resolution patterns. It is suitable for the precision processing of semiconductor chips and microelectronic devices, improving the integration and reliability of the devices.
5.特种粘合剂和密封剂:
Used in the preparation of cationic curing adhesives and sealants, it improves the fluidity and wettability of the product, enhancing the bonding strength and sealing effect on substrates such as metals, ceramics, and engineering plastics. It is suitable for structural bonding and sealing in high-end industrial fields such as aerospace and automotive manufacturing.
6.复合材料基质树脂:
When combined with glass fibers, carbon fibers, etc., it is used to prepare high-performance composite materials, improving the mechanical strength, aging resistance, and processing fluidity of the materials. It is suitable for the preparation of structural components in aerospace, rail transit, and other fields with stringent requirements for comprehensive material performance.
7. Resin Modification and Synthesis:
It can be used as a modifying monomer in the synthesis and modification of epoxy resins, polyester resins, etc., reducing system viscosity and improving the flexibility, weather resistance, and chemical resistance of the cured product. It is suitable for the development of resin systems with high performance requirements.