1. Revestimentos de cura por UV:

Used as a reactive diluent and functional monomer in UV-curing coatings, suitable for substrates such as wood, plastics, and metals, providing high hardness, excellent adhesion, low shrinkage, and chemical resistance. It can be used in anticorrosive coatings, plastic surface treatment coatings, and conformal coatings for electronic circuit boards (moisture-proof, salt spray-proof, and mildew-proof).

2. Tintas de cura UV:

Used in printing inks (such as packaging, labels, and PCB circuit board inks), improving curing speed, abrasion resistance, and solvent resistance, suitable for flexographic and screen printing processes.

3. Adesivos de cura UV:

Used in structural and encapsulating adhesives for optical components, electronic devices, automotive, and aerospace applications, offering high transparency, low shrinkage, good bonding strength, and high-temperature resistance.

4. Materiais de impressão 3D:

As a key monomer in photocurable 3D printing resins, it provides printed parts with high Tg (approximately 120℃), low shrinkage, and good mechanical properties, suitable for high-precision industrial and dental models.

5. Resin Modification and Synthesis:

Usado para a modificação de resinas acrílicas, melhorando a densidade de reticulação, a resistência à água e a resistência química da resina, expandindo suas aplicações em revestimentos, adesivos e outros campos.

6. Composite Materials:

Used in fiberglass modification to improve the interfacial bonding strength of the resin matrix, and also used in carbon fiber prepregs to improve fiber wettability.

7. Materiais de embalagem eletrônica:

Participa da preparação de materiais de embalagem de componentes eletrônicos, aprimorando a resistência à umidade e ao calor e o desempenho de isolamento do material, garantindo a estabilidade de dispositivos eletrônicos em ambientes complexos.

8. Intermediários de química fina:

Used in the synthesis of other fine chemicals, such as insecticides and fungicides in the pesticide field.