CHLUMICRYL® 203 CAS 142627-97-2

203 is a bifunctional oxetane suitable for cationic curing. It can improve curing speed, reduce the shrinkage, provide good chemical resistance and excellent physical strength.

Product Information

Chemical Name:1,4-Bis[(3-ethyl-3-oxetanylmethoxy) methyl] benzene

Molecular Weight:334.45

CAS No:142627-97-2

Description

Technical Parameters

Appearance:

Very viscous yellow liquid to solid

Water Content:≤0.15%

Benefits

High reactivity

Good chemical resistance and excellent physical strength

Applications

203 is often used as a monomer for electronic material packaging and special adhesives. Please preheat to 50~60 ºC before use to reduce viscosity.

Storage & Packaging

Keep in a tightly closed container and store in a cool, dry, dark, ventilated area. After opening, it will gradually absorb moisture and become invalid. Effective from the date of production, within 6 months. Packaging: 20kg/pail.

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203 Application scenarios

1. Cationic UV/Thermal Curing Coatings:

Used as a crosslinking monomer or reactive diluent in cationic UV/thermal curing coating systems, it reduces viscosity and increases the crosslinking density of the cured product. The cured coating exhibits excellent chemical resistance, weather resistance, and adhesion, making it suitable for industrial protection and decoration of substrates such as metals, plastics, and wood, especially for coatings requiring high weather resistance and low yellowing.

2. Electronic Materials and PCB Manufacturing:

Used in PCB solder mask inks, electronic component encapsulation materials, and insulating coatings, the cured material exhibits stable dielectric properties, excellent insulation, and resistance to humidity and heat, ensuring the stable operation of electronic devices under complex working conditions. It is suitable for microelectronic packaging and precision processing of circuit boards.

3. Optical Material Preparation:

Applied in fields such as optical films and optical adhesives, it reduces curing volume shrinkage, improves the dimensional stability and light transmittance of optical components, meeting the high precision and high transparency requirements of optical lenses and display devices.

4. Photoresists and Microelectronic Processing:

As a crosslinking component or resin matrix for photoresists, it is compatible with i-line, KrF, and other photolithography processes, facilitating the preparation of high-resolution patterns. It is suitable for the precision processing of semiconductor chips and microelectronic devices, improving the integration and reliability of the devices.

5. Specialty Adhesives and Sealants:

Used in the preparation of cationic curing adhesives and sealants, it improves the fluidity and wettability of the product, enhancing the bonding strength and sealing effect on substrates such as metals, ceramics, and engineering plastics. It is suitable for structural bonding and sealing in high-end industrial fields such as aerospace and automotive manufacturing.

6. Composite Material Matrix Resins:

When combined with glass fibers, carbon fibers, etc., it is used to prepare high-performance composite materials, improving the mechanical strength, aging resistance, and processing fluidity of the materials. It is suitable for the preparation of structural components in aerospace, rail transit, and other fields with stringent requirements for comprehensive material performance.

7. Resin Modification and Synthesis:

It can be used as a modifying monomer in the synthesis and modification of epoxy resins, polyester resins, etc., reducing system viscosity and improving the flexibility, weather resistance, and chemical resistance of the cured product. It is suitable for the development of resin systems with high performance requirements.

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