CHLUMICRYL® 203 CAS 142627-97-2

203 adalah oksetan bifungsional yang cocok untuk pengawetan kationik. Ini dapat meningkatkan kecepatan pengeringan, mengurangi penyusutan, memberikan ketahanan kimia yang baik dan kekuatan fisik yang sangat baik.

Informasi Produk

Nama kimia: Nama kimia1,4-Bis [(3-etil-3-oktetanylmethoxy) metil] benzena

Berat Molekul: Berat molekul334.45

CAS No:142627-97-2

Deskripsi

Parameter Teknis

Penampilan: Penampilan

Cairan kuning yang sangat kental hingga padat

Kandungan Air : ≤0.15%

Manfaat

Reaktivitas tinggi

Ketahanan kimia yang baik dan kekuatan fisik yang sangat baik

Aplikasi

203 sering digunakan sebagai monomer untuk kemasan bahan elektronik dan perekat khusus. Harap panaskan terlebih dahulu hingga 50 ~ 60 ºC sebelum digunakan untuk mengurangi viskositas.

Penyimpanan & Pengemasan

Simpan dalam wadah tertutup rapat dan simpan di tempat yang sejuk, kering, gelap, dan berventilasi. Setelah dibuka, secara bertahap akan menyerap kelembapan dan menjadi tidak valid. Berlaku sejak tanggal produksi, dalam waktu 6 bulan. Kemasan: 20kg / ember.

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203 Application scenarios

1. Pelapis UV / Thermal Curing Kationik:

Used as a crosslinking monomer or reactive diluent in cationic UV/thermal curing coating systems, it reduces viscosity and increases the crosslinking density of the cured product. The cured coating exhibits excellent chemical resistance, weather resistance, and adhesion, making it suitable for industrial protection and decoration of substrates such as metals, plastics, and wood, especially for coatings requiring high weather resistance and low yellowing.

2. Bahan Elektronik dan Manufaktur PCB:

Used in PCB solder mask inks, electronic component encapsulation materials, and insulating coatings, the cured material exhibits stable dielectric properties, excellent insulation, and resistance to humidity and heat, ensuring the stable operation of electronic devices under complex working conditions. It is suitable for microelectronic packaging and precision processing of circuit boards.

3. Persiapan Bahan Optik:

Applied in fields such as optical films and optical adhesives, it reduces curing volume shrinkage, improves the dimensional stability and light transmittance of optical components, meeting the high precision and high transparency requirements of optical lenses and display devices.

4. Photoresists and Microelectronic Processing:

As a crosslinking component or resin matrix for photoresists, it is compatible with i-line, KrF, and other photolithography processes, facilitating the preparation of high-resolution patterns. It is suitable for the precision processing of semiconductor chips and microelectronic devices, improving the integration and reliability of the devices.

5. Specialty Adhesives and Sealants:

Used in the preparation of cationic curing adhesives and sealants, it improves the fluidity and wettability of the product, enhancing the bonding strength and sealing effect on substrates such as metals, ceramics, and engineering plastics. It is suitable for structural bonding and sealing in high-end industrial fields such as aerospace and automotive manufacturing.

6. Composite Material Matrix Resins:

When combined with glass fibers, carbon fibers, etc., it is used to prepare high-performance composite materials, improving the mechanical strength, aging resistance, and processing fluidity of the materials. It is suitable for the preparation of structural components in aerospace, rail transit, and other fields with stringent requirements for comprehensive material performance.

7. Resin Modification and Synthesis:

It can be used as a modifying monomer in the synthesis and modification of epoxy resins, polyester resins, etc., reducing system viscosity and improving the flexibility, weather resistance, and chemical resistance of the cured product. It is suitable for the development of resin systems with high performance requirements.

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