1. ArF Photoresist Resin Synthesis:

As a key comonomer for ArF (193nm) photoresists, it is used to prepare the main resin for chemically amplified photoresists (CAR), improving the resolution, exposure contrast, and dry etching resistance of the photoresist, suitable for integrated circuits (IC) and memory chip manufacturing in advanced processes of 65nm and below.

2. Advanced Semiconductor Packaging Materials:

Used as photosensitive dielectric layers and passivation materials for wafer-level packaging (WLP) and fan-out packaging, providing high-resolution patterning capabilities and chemical resistance, suitable for advanced packaging processes such as chip stacking and TSV (Through-Silicon Via).

3. Flat Panel Display (FPD) Photoresist:

Used as pixel definition layer (PDL) and planarization layer (PLN) photoresist for LCD/TFT and OLED display panels, improving graphic precision and process stability, suitable for the manufacturing of high-resolution, narrow-bezel display panels.

4. Polymer Material Modification:

Used as a comonomer in the synthesis of polyacrylates, polyimides, etc., introducing a rigid adamantane structure to improve the thermal stability (Tg can reach above 150℃), mechanical strength, and solvent resistance of the polymer, suitable for the preparation of high-temperature resistant engineering plastics and special elastomers.

5. UV-Curing 3D Printing Resin:

Used for cross-linking modification of SLA/DLP UV-curing 3D printing resins, improving the heat resistance, dimensional accuracy, and surface hardness of molded parts, suitable for rapid prototyping in fields with high material performance requirements such as aerospace and precision molds.

6. Electronic Packaging and Coatings:

Used as insulating coatings and encapsulating adhesives for electronic components, providing high temperature resistance, low moisture absorption, and excellent dielectric properties, suitable for the protection and packaging of electronic devices under high-temperature working conditions.

7. Pharmaceutical and Fine Chemical Intermediates:

Used in the synthesis of drug intermediates containing adamantane structures (such as antiviral and antitumor drug precursors), utilizing its rigid skeleton to optimize the metabolic stability and targeting of drug molecules, suitable for drug research and development and fine chemical synthesis.

8. Specialty Coatings and Inks:

Used in high-temperature and high-hardness industrial coatings and printing inks, enhancing the weather resistance, scratch resistance, and chemical corrosion resistance of the coatings. Suitable for special coating applications such as automotive parts and high-temperature equipment.