1. Radiation-Curing Coatings:

Used as a reactive diluent and crosslinking agent to reduce system viscosity, improve curing speed, and enhance film hardness, abrasion resistance, and chemical resistance. Suitable for UV/EB curing coatings on substrates such as wood, plastics, and metals.

2. Radiation-Curing Inks:

Used in printing inks to improve rheological properties and printability. After curing, the patterns have strong adhesion, abrasion resistance, and solvent resistance. Suitable for printing on paper, plastic films, and metal foils.

3. Adesivos fotocuráveis:

Participates in the crosslinking of acrylate adhesives, improving bonding strength, water resistance, and aging resistance. Used for structural bonding and assembly of different materials such as plastics, metals, and glass.

4. Photosensitive Resin Plates:

Used in the preparation of photosensitive resin plates for printing, improving the resolution, print durability, and solvent resistance of the plates. Suitable for flexographic and letterpress printing processes.

5. Composite Material Manufacturing:

Used as a reactive diluent and crosslinking agent for resin matrices, improving the wettability of the resin to fibers and enhancing the mechanical properties and aging resistance of composite materials. Used in glass fiber and carbon fiber reinforced composites.

6. Materiais de impressão 3D:

Used in photocurable 3D printing resins, providing the material with fast curing characteristics and high-precision molding capabilities. Suitable for manufacturing complex structures and functional parts.

7. Rubber and Plastic Modification:

Used for rubber radiation crosslinking and plastic modification, improving the strength, heat resistance, and dimensional stability of the products. Suitable for the production of special rubbers and engineering plastics.

8. Electronic Materials:

Used in electronic component encapsulation materials, circuit board coatings, etc., improving the insulation, moisture and heat resistance, and aging resistance of electronic materials, ensuring the stability of electronic devices.