설명
기술 매개변수
모양: 외관
무색 투명한 액체
순도(GC): ≥97.00%
수분 함량: ≤0.30%
혜택
높은 반응성
유연성과 견고함의 균형
애플리케이션
109는 전자 재료 포장 및 특수 접착제용 모노머로 자주 사용됩니다.
보관 및 포장
밀폐 용기에 넣어 서늘하고 건조하며 어둡고 통풍이 잘되는 곳에 보관하세요. 생산일로부터 1년 이내에 유효합니다. 포장: 20kg/통.
109는 양이온 경화에 적합한 단기능성 옥세탄으로, 유연성을 위해 구조적으로 개선되었습니다. 시스템의 경화 속도를 향상시키고 수축을 줄일 수 있습니다. 연성과 경화 강도를 모두 갖추고 있습니다.
제품 정보
화학 이름: 화학 물질
3-에틸-3-[(2-에틸헥실록시)메틸]옥세탄
분자량:228.37
CAS 번호: : CAS 번호298695-60-0
기술 매개변수
모양: 외관
무색 투명한 액체
순도(GC): ≥97.00%
수분 함량: ≤0.30%
혜택
높은 반응성
유연성과 견고함의 균형
애플리케이션
109는 전자 재료 포장 및 특수 접착제용 모노머로 자주 사용됩니다.
보관 및 포장
밀폐 용기에 넣어 서늘하고 건조하며 어둡고 통풍이 잘되는 곳에 보관하세요. 생산일로부터 1년 이내에 유효합니다. 포장: 20kg/통.
1. 양이온 UV/열 경화 코팅:
As a reactive diluent, it significantly reduces the viscosity of coating systems, improving application flowability. The cured coating exhibits excellent chemical resistance, weather resistance, and adhesion, suitable for industrial protection and decoration of substrates such as metals, plastics, and wood, especially for coating systems requiring high weather resistance and low yellowing.
2. Electronic Materials and PCB Manufacturing:
Used in PCB solder mask inks, electronic component encapsulation materials, and insulating coatings, its low viscosity improves processing performance. The cured material has stable dielectric properties and excellent insulation, ensuring stable operation of electronic devices in complex environments such as high humidity, high temperature, and low temperature, suitable for microelectronic packaging and precision processing of circuit boards.
3. 광학 재료 준비:
Applied in optical films and optical adhesives, it reduces curing volume shrinkage, improving the dimensional stability and light transmittance of optical components, meeting the high precision and high transparency requirements of optical lenses and display devices.
4. 잉크 산업:
As a reactive diluent for UV-curing inks, it reduces ink viscosity to suit processes such as screen printing and flexographic printing. The cured ink film has good wear resistance and weather resistance, suitable for packaging printing and other applications.
5. 접착제 및 실란트:
Used in the preparation of cationic curing adhesives and sealants, it improves product flowability and enhances the bonding strength and sealing effect on various substrates such as metals, ceramics, and engineering plastics, suitable for bonding and sealing of industrial components.
6. 레진 수정 및 합성:
Used as a modifying monomer in the synthesis and modification of epoxy resins, polyester resins, etc., it reduces system viscosity and improves the flexibility, weather resistance, and chemical resistance of the cured product, suitable for the development of resin systems with high performance requirements.
7. Composite Material Matrix Resins:
Combined with other cationic curing resins, it is used to prepare high-performance composite materials, improving the mechanical strength, aging resistance, and processing flowability of the materials, suitable for the preparation of structural components with stringent requirements for overall material performance in aerospace and automotive manufacturing.
8. Organic Synthesis Intermediates:
Used in the synthesis of polymer materials or functional resins, such as low-viscosity epoxy resins and modified polyester resins, suitable for applications in electronic encapsulation, UV-curing coatings, etc.