1. 양이온 UV/열 경화 코팅:

Used as a reactive diluent in cationic UV/thermal curing coating systems, it reduces viscosity and increases the crosslinking density of the cured product. The cured coating exhibits excellent chemical resistance, weather resistance, and adhesion, making it suitable for industrial protection and decoration of substrates such as metals, plastics, and wood, especially for coating applications requiring high weather resistance and low yellowing.

2. UV Inks and Printing Industry:

Used in UV-curing inks, it improves ink flow and wettability, suitable for screen printing, flexographic printing, and other processes. The cured ink film has good abrasion resistance and weather resistance, suitable for packaging printing, label printing, and other applications.

3. UV 접착제 및 실란트:

Used in the preparation of cationically curable UV adhesives and sealants, it enhances the bonding strength and sealing effect on substrates such as metals, ceramics, and engineering plastics, suitable for bonding and sealing in electronic components and optical devices.

4. Electronic Materials and PCB Manufacturing:

Used in PCB solder mask inks, electronic component encapsulation materials, and insulating coatings, the cured materials have stable dielectric properties, excellent insulation, and resistance to humidity and heat, ensuring the stable operation of electronic devices under complex working conditions, suitable for microelectronic packaging and precision processing of circuit boards.

5. Optical Material Preparation:

Applied in optical films and optical adhesives, it reduces curing volume shrinkage and improves the dimensional stability and light transmittance of optical components, meeting the high precision and high transparency requirements of optical lenses and display devices.

6. 3D 프린팅 포토폴리머 수지:

Used as a reactive diluent and crosslinking monomer in 3D printing photopolymer resins, it reduces resin viscosity to improve printing fluidity. The cured products have high precision and good mechanical properties, suitable for high-precision 3D printing.

7. Photoresists and Microelectronic Processing:

Used as a crosslinking component or resin matrix in photoresists, it is compatible with microelectronic processing techniques, helping to prepare high-resolution patterns, suitable for the precision processing of semiconductor chips and microelectronic devices, improving the integration and reliability of the devices.

8. Resin Modification and Synthesis:

Used as a modifying monomer in the synthesis and modification of epoxy resins, polyester resins, etc., it reduces system viscosity and improves the flexibility, weather resistance, and chemical resistance of the cured product. It is suitable for the development of resin systems with high performance requirements.

9. 유기 합성 중간:

Used in the synthesis of functional polymer materials, such as low-viscosity epoxy resins and modified polyester resins, it is suitable for applications such as electronic encapsulation and UV-curing coatings.