1. ArF Photoresist Core Monomer:

Used in the preparation of chemically amplified photoresist polymers for 193nm ArF excimer laser lithography, providing transparency to 193nm wavelength light and enabling fine pattern transfer in advanced (7-45nm) semiconductor chip manufacturing processes.

2. Anaerobic Adhesive Preparation Raw Material:

As a co-monomer in anaerobic adhesives, it works with other components to optimize the curing performance, breaking torque, and disassembly torque of the adhesive, suitable for industrial assembly applications such as thread locking and sealing.

3. Thermally Releasable Adhesive Component:

Combined with monomers such as methyl methacrylate, it is used in thermally releasable adhesives to reduce the repulsive force between the adhesive and the contact surface, improve initial tack, and allow for easy removal upon heating, reducing contamination of the bonded surface. Suitable for temporary fixing and precision processing of electronic components.

4. Functional Polymer Synthesis Intermediate:

Used in the synthesis of specialty polymers, introducing cyclopentyl and ester functional groups to control the weather resistance, flexibility, and environmental stability of the material. Suitable for the preparation of high-performance coatings, elastomers, and other functional polymer materials.

5. Fine Chemicals and Medical Materials:

Used in the synthesis of dental restorative materials and high-end composite materials, improving the mechanical strength and durability of the materials. Suitable for applications in oral medicine, aerospace, and other fields with stringent material performance requirements.

6. UV-Curing Material Crosslinking Monomer:

Used in the crosslinking system of UV-curing coatings and inks, reducing system viscosity and improving the hardness, adhesion, and chemical resistance of the cured coating. Suitable for high-efficiency curing applications such as 3C product coating and printing packaging.