1. UV/EB 경화 코팅:

Used as a reactive diluent in coatings for substrates such as plastics (PC, ABS, etc.), metals, paper, and films, improving adhesion (especially to PC), flexibility, and water resistance. Suitable for low-shrinkage, bend-resistant coatings in applications such as consumer electronics casings, automotive interior parts, and flexible packaging.

2. 인쇄 잉크:

Suitable for UV offset printing, flexographic printing, screen printing, and inkjet inks, improving pigment dispersion and adhesion to non-polar substrates, and reducing curing shrinkage. Suitable for applications requiring high environmental protection and printing quality, such as food packaging, labels, and metal cans.

3. UV 경화 접착제 및 실란트:

Used in electronic component bonding, optical device encapsulation, and medical bonding. As a reactive diluent, it balances bonding strength and flexibility. Suitable for bonding applications requiring high transparency, aging resistance, and high adhesion to materials like PC.

4. 3D 프린팅 포토폴리머 수지:

Used as a diluent monomer in SLA/DLP photopolymer 3D printing resins, optimizing the accuracy, surface quality, and toughness of molded parts. Suitable for rapid prototyping in areas such as industrial models, dental models, and creative products.

5. 폴리머 합성 및 수정:

Used in the synthesis of polyacrylates, polyesters, polyurethanes, etc., and can be copolymerized with butadiene, improving the flexibility, weather resistance, and processing performance of polymers. Suitable for the preparation of elastomers, modified plastics, and other polymer materials.

6. Biomaterials and Composite Materials:

Used as an acrylic matrix for preparing silver nanoparticle/polymer nanocomposites, and can also be grafted to modify cellulose and protein fibers. Suitable for biomaterials and composite materials applications such as biosensors and functional fibers.

7. Electronics and Flexible Materials:

Used in PCB coatings, flexible electronic packaging, and photoresists, providing moisture and heat resistance, chemical resistance, and dielectric properties. Suitable for insulation protection of electronic components such as flexible circuits and sensors.

8. Resin and Coating Dilution and Plasticization:

It acts as a diluent and plasticizer for thermosetting resins (such as amino resins), lowering the curing temperature (approximately 100℃), improving coating flexibility, and is suitable for industrial coatings, adhesives, and other applications requiring low-temperature curing.