1. Pelapis Pengawet UV:

Used for protective and decorative coatings on substrates such as metals, plastics, and wood, including automotive refinish paints, furniture topcoats, and electronic insulation paints. After curing, they form a high-hardness, chemically resistant, and strongly adhesive film, suitable for high-efficiency coating and high-temperature conditions.

2. Printing and Electronic Inks:

As a key component in UV screen printing inks, flexographic inks, and PCB solder mask inks, they improve curing speed, abrasion resistance, solvent resistance, and resolution, ensuring the clarity and durability of printed patterns and circuits.

3. Perekat Pengawet UV:

Used for structural bonding and encapsulation of optical devices, electronic components, and glass/metal/plastics, such as LED and sensor assembly, providing high bonding strength, water resistance, and heat resistance, suitable for rapid mass production.

4. Fotoresis dan Bahan Elektronik:

Used in semiconductors, PCB dry film photoresists, and display panel photoresists, enhancing etch resistance, resolution, and thermal stability, supporting fine line and micro-pattern processing.

5. Polymer Crosslinking Modification:

As a crosslinking agent for rubber and synthetic resins, it builds a dense network through photo/thermal polymerization, improving material mechanical strength, aging resistance, and dimensional stability, suitable for automotive and aerospace structural components.

6. Resin Pencetakan 3D:

Used as consumables for SLA/DLP UV-curing 3D printing, improving the accuracy, surface finish, and mechanical properties of printed parts, suitable for rapid prototyping of industrial models and functional parts.

7. Optical and Electronic Packaging:

Used in fiber optic coatings, optical lens resins, and LED/circuit board packaging, improving micro-bending resistance, insulation, moisture resistance, and aging resistance, ensuring long-term reliability of devices.

8. Fine Chemicals and Composite Materials:

Used as synthetic building blocks for the development of specialty chemicals, and can also be compounded with glass fibers/carbon fibers to prepare high-strength, low-shrinkage engineering plastics for electronic housings and automotive structural components.