1. UV/EB Curing Coating Systems:
As a bifunctional reactive diluent, it reduces coating viscosity and increases curing speed. The cured coating exhibits excellent flexibility and chemical resistance, suitable for the protection and decoration of substrates such as metals, plastics, and wood.
2. Cationic Curing Composite Systems:
Compatible with cationic UV/thermal curing formulations, it improves system compatibility and crosslinking density, enhancing the adhesion and heat and humidity resistance of the cured product. Used in industrial protective coatings and high-performance decorative coatings.
3. Electronic Materials Manufacturing:
Used in solder mask inks for printed circuit boards (PCBs), electronic component encapsulation materials, and insulating coatings. The cured material has excellent insulation and stable dielectric properties, ensuring reliable operation of electronic devices in complex environments.
4. Optical Materials Preparation:
Applied in optical films and optical adhesives, it reduces curing volume shrinkage and improves the dimensional stability and light transmittance of optical components, meeting the high-precision requirements of optical lenses and display devices.
5. Ink Industry Applications:
As a reactive diluent for UV-curing inks, it is compatible with screen printing, flexographic printing, and other printing processes. The cured ink film is wear-resistant and weather-resistant, suitable for packaging printing, label printing, and other applications.
6. Adhésifs et produits d'étanchéité :
Used in the preparation of dual-curing adhesives and sealants, enhancing the bonding strength and sealing effect on various substrates. Suitable for industrial component assembly and electronic component fixing.
7. Functional Polymer Synthesis:
Used as a polymerization monomer to prepare special-structure polymers, it can impart specific properties to materials, such as low shrinkage and high toughness, and is applied in polymer material modification and functional material research and development.
8. Biomedical Materials:
Has potential applications in dental materials and medical adhesives, utilizing its low toxicity and rapid curing characteristics to meet the safety and processability requirements of biomedical materials.
