CHLUMOFIUOR® Perfluorooctylethyltriethoxysilane CAS 101947-16-4

Product Information

Product name: FL102

Chemical name: Perfluorooctylethyltriethoxysilane

Chemical formula: (CH3CH2O)3SiCH2CH2(CF2)8F

Description

Ingredient and component information

Material name: Perfluorooctylethyltriethoxysilane

CAS Code:101947-16-4

EINECS code:None

TSCA:Not listed

Purity:> 97

Physical and Chemical Properties

Color: colorless

Molecular weight: 610.38

Boiling point: 218 ℃@760mmHg

Melting point: -50.71 ℃

Flash point: None

Vapor pressure: <1mmHg@20°C

Vapor density (air=1): 21.2

Decomposition Temperature: No data

Ignition point: No data

Explosion Limit: No data

Density: 1.4889g/mL @ 15°C

Refractive index: 1.342@ 20℃

Solubility in water: react with water

Other Name:

(1H,1H,2H,2H – Perfluorodec – 1 – yl)tris(ethoxy)silane

(Heptadecafluoro – 1,1,2,2 – tetrahydrodecyl)-1 – triethoxysilane

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Application scenarios

1. Surface Treatment of Glass and Optical Devices:

Used for mobile phone screens, camera lenses, optical lenses, etc., to form anti-fingerprint, anti-fouling, and hydrophobic coatings without affecting light transmittance, improving cleanliness and durability.

2. Surface Modification of Inorganic Materials:

Treats ceramics, stone, metals, wood, and composite materials to reduce surface energy, achieving waterproofing, oil resistance, corrosion resistance, and easy cleaning, such as for building facades, stone decorations, and metal component protection; also used for waterproofing, anti-fouling, and weathering protection of cultural relics and masonry.

3. Fluorosilicone Coatings and Coating Additives:

Used as a component in coating formulations to prepare high-performance fluorosilicone coatings for outdoor buildings, bridges, ships, electronic appliances, etc., improving weather resistance, wear resistance, chemical corrosion resistance, and stain resistance; also used as a leveling agent and wetting agent to improve coating application and performance.

4. Adhesives and Sealants:

Used in fluoropolymer and silicone adhesives to improve interfacial compatibility and bonding strength with inorganic substrates (glass, metal, ceramics), improving moisture and oil resistance of the adhesive layer, suitable for precision electronics and aerospace component bonding.

5. Microfluidic Chip and Device Manufacturing:

Used to modify the surface of polymethyl methacrylate (PMMA) to prepare microfluidic chips, and for silanization of substrates in soft lithography processes to reduce surface energy for microfluidic manipulation and device demolding.

6. Nanomaterials and Functional Thin Film Preparation:

Used for the functionalization of nanoporous hydrophobic ceramic membranes and the construction of superhydrophobic polyimide nanotube arrays; used as a coating additive in sol-gel systems to prepare high-performance functional thin films.

7. Fluorosilicone Compound Synthesis:

Used as a synthetic intermediate for fluorine-containing and organosilicon compounds to prepare various fluorosilicone materials, meeting performance requirements in special application scenarios.

8. Electronics and Semiconductor Fields:

Used for moisture-proof and insulating coatings on electronic components and circuit boards, protecting circuits and devices from moisture and contaminants, improving stability and service life.

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