설명
기술 매개변수
모양: 외관
무색 투명한 액체
순도(GC): ≥98.00
수분 함량: ≤0.30%
혜택
높은 반응성
가교 밀도가 높습니다.
애플리케이션
201은 전자 재료 포장 및 특수 접착제용 모노머로 자주 사용됩니다.
보관 및 포장
밀폐된 용기에 넣어 서늘하고 건조하며 어둡고 통풍이 잘되는 곳에 보관하세요. 생산일로부터 6개월 이내에 유효합니다. 포장: 20kg/통, 25kg/통, 200kg/드럼.
201은 양이온 경화에 적합한 이중 기능성 옥세탄입니다. 경화 속도를 개선하고 수축을 줄일 수 있습니다. TCM201은 대칭 구조를 가지고 있어 경화 후 조밀하고 균일한 가교 네트워크를 형성할 수 있습니다. 가교 밀도를 크게 높일 수 있습니다.
제품 정보
화학 이름: 화학 물질3-에틸-3(((3-에틸옥세탄-3-일) 메톡시) 메틸) -옥세탄
분자량: 분자량214.30
CAS 번호: : CAS 번호18934-00-4
기술 매개변수
모양: 외관
무색 투명한 액체
순도(GC): ≥98.00
수분 함량: ≤0.30%
혜택
높은 반응성
가교 밀도가 높습니다.
애플리케이션
201은 전자 재료 포장 및 특수 접착제용 모노머로 자주 사용됩니다.
보관 및 포장
밀폐된 용기에 넣어 서늘하고 건조하며 어둡고 통풍이 잘되는 곳에 보관하세요. 생산일로부터 6개월 이내에 유효합니다. 포장: 20kg/통, 25kg/통, 200kg/드럼.
1. 양이온 UV/열 경화 코팅:
As a crosslinking monomer and reactive diluent, it reduces the viscosity of the coating system and increases crosslinking density. The cured coating exhibits excellent chemical resistance, weather resistance, and adhesion, making it suitable for industrial protection and decoration of substrates such as metals, plastics, and wood, especially for coating systems requiring high weather resistance and low yellowing.
2. Electronic Materials and PCB Manufacturing:
Used in PCB solder mask inks, electronic component encapsulation materials, and insulating coatings, its low viscosity improves processing performance. The cured material has stable dielectric properties and excellent insulation, ensuring the stable operation of electronic devices in complex environments such as high humidity, high temperature, and low temperature, making it suitable for microelectronic packaging and precision processing of circuit boards.
3. 광학 재료 준비:
Applied in optical films and optical adhesives, it reduces curing volume shrinkage, improving the dimensional stability and light transmittance of optical components, meeting the high precision and high transparency requirements of optical lenses and display devices.
4. 잉크 산업:
As a reactive diluent for UV-curing inks, it reduces ink viscosity to suit processes such as screen printing and flexographic printing. The cured ink film has good wear resistance and weather resistance, suitable for packaging printing and other applications.
5. 접착제 및 실란트:
Used in the preparation of cationic curing adhesives and sealants, it improves product fluidity and enhances the bonding strength and sealing effect on various substrates such as metals, ceramics, and engineering plastics, suitable for bonding and sealing of industrial components.
6. 레진 수정 및 합성:
Used as a modifying monomer in the synthesis and modification of epoxy resins, polyester resins, etc., it reduces system viscosity and improves the flexibility, weather resistance, and chemical resistance of the cured product, suitable for the development of resin systems with high performance requirements.
7. Composite Material Matrix Resins:
Compounded with other cationic curing resins, it is used to prepare high-performance composite materials, improving the mechanical strength, aging resistance, and processing fluidity of the material, suitable for the preparation of structural components with stringent requirements on overall material performance in aerospace and automotive manufacturing.